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TESCAN ORSAY HOLDING, a.s. demonstrated its semiconductor failure analysis workflow at ISTFA 2026, built around Inspect, Access, Prepare and Analyze stages. Conference discussions covered AI-assisted workflows, laser sample preparation and strain analysis.

Rigaku has launched the CT Lab HR160, an X-ray CT system combining its imaging expertise with Excillum's NanoTube N3 X-ray source. It operates at up to 160 kV and achieves true 250 nm spatial resolution.

TESCAN ORSAY HOLDING, a.s. has described an A15 semiconductor failure analysis workflow that connects X-ray CT, ultrafast laser processing, optical and confocal microscopy, and SEM for progressive access to buried structures.

JEOL has started sales of HAXIS, a scanning electron microscope with low-angle argon ion milling and passive voltage contrast detection, for layer-by-layer semiconductor failure analysis.

NanoImages, LLC has published details of its EBIC imaging technique for semiconductor failure analysis. The SNE-Alpha carries a factory EBIC port alongside its EDS, EBSD, Raman, and CL ports, with a 1-30 kV range.