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Fraunhofer IZM and Swissbit Address Europe's Low-Volume Advanced Packaging Gap
Fraunhofer IZM and Swissbit described Europe's advanced packaging gap between pilot production and mass manufacturing. Fraunhofer's Rolf Aschenbrenner and Swissbit's Lars Lust said low volumes such as 20 to 100 wafers per year are too small for large OSAT providers.
Oct 132 min read
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