NEWSROOM

ASM International has introduced ASM Flowable Carbon, a PECVD Flowable Carbon film engineered for fill, planarization, and patterning in advanced logic and memory device scaling.

TESCAN ORSAY HOLDING, a.s. has described an A15 semiconductor failure analysis workflow that connects X-ray CT, ultrafast laser processing, optical and confocal microscopy, and SEM for progressive access to buried structures.