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Zeiss SMT announced its entry into wafer inspection systems at SEMICON West 2026, showcasing the Zeiss DUNE and Zeiss NLX products.

The Department of Commerce's CHIPS Program Office has amended GlobalFoundries' existing award, reallocating up to $955m in incentives. GlobalFoundries will expand its capital investment in Malta, NY and Burlington, VT to $5bn.

GlobalFoundries has been selected as technology provider and operator for two new semiconductor fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding.

GlobalFoundries was selected as technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding. An initial investment of approximately $10 billion will accelerate construction of a new 300mm fab expected to come online in 2029.

Fraunhofer IZM and Swissbit described Europe's advanced packaging gap between pilot production and mass manufacturing. Fraunhofer's Rolf Aschenbrenner and Swissbit's Lars Lust said low volumes such as 20 to 100 wafers per year are too small for large OSAT providers.

TESCAN ORSAY HOLDING, a.s. has described an A15 semiconductor failure analysis workflow that connects X-ray CT, ultrafast laser processing, optical and confocal microscopy, and SEM for progressive access to buried structures.